设备及零配件-新茗半导体

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设备及零配件返回

高速电镀线，高速环形电镀线。(HK-2000)

产品详细

加工宽度:15-60MM
      外型尺寸：L20000 x W1750 x H1600 mm
    高速环型电镀生产线是专门设计用来满足半导体行业集成电路可焊性管脚电镀的自动化设备，它具有先进的自动化技术和电镀工艺技术，可得到质量优异的可焊性镀层。框架基材：铜合金、铁镍合金（两种基材）产量：1800-2500条/小时。
   设备的框架采用不锈钢304构件，从而有效防止化学药水的腐蚀；框架为可拆卸型，以利于运输与安装；采用全封闭的外盖设计，污染减少。
采用PLC作为控制器，同时采用基于Windows操作系统的自动化控制软件作为整个机器的操作控制系统，从而实现优良的人机操作界面和数据的有效输入和采集；系统的整体控制采用欧姆龙PLC；采用进口316材质的钢带进行传送系统，原装进口高压泵,可以适用于各种封装形式的IC和分立器件，具有广泛的适应性。可以根据客户要求进行定制。

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